INTERFACE |
DIMENSIONS : 130.9 x 112.8 x 166.5 mm / 5.2 x 4.4 x 6.5 inch
HEAT SINK DIMENSIONS : 116 x 60 x 158 mm / 4.5 x 2.4 x 6.2 inch
HEAT SINK WEIGHT : 616g / 1.35lb
HEAT PIPE DIMENSIONS : Ø6mm
FAN DIMENSIONS : 120 x 120 x 25 mm / 4.7 x 4.7 x 1 inch |
Others |
COOLER TYPE : Air Cooler
SERIES : MasterAir
HEATPIPES : 6
CPU SOCKET : LGA2066, LGA2011-v3, LGA2011, LGA1151, LGA1150, LGA1155, LGA1156, LGA1366, LGA775, AM4, AM3+, AM2+, AM2, FM2+, FM2, FM1
HEAT SINK MATERIAL : 6 Heat Pipes, Direct Contact, Aluminum Fins |
FAN Features |
FAN SPEED : 600-1800 RPM ± 10%
FAN AIRFLOW : 53.38 CFM (Max)
FAN AIR PRESSURE : 1.65 mmH2O (Max)
FAN MTTF : 40,000 Hours
LED COLOR : RGB Ready
FAN NOISE LEVEL : 35 dBA (Max)
FAN POWER CONNECTOR : 4-Pin (PWM)
FAN RATED VOLTAGE : 12V DC
FAN RATED CURRENT : 0.30A
FAN SAFETY CURRENT : 0.37A
FAN POWER CONSUMPTION : 4.44W |
CM MasterAir MA610P RGB Air Cooler Overview
PERFORMANCE & STYLE
The MA610P is for enthusiasts and gamers to push their systems to the limit. Exceptional cooling performance is a must to keep it running stable and at max speeds. The MA610P is also stylishly design to match the precision engineered components in your build. It even comes with a dual RGB fans and controller for you to change the your lighting without limitations.
PRECISION ENGINEERED HEATSINK
Cooler Master's aluminum fin craftmanship is second to none. Optimized fin stacked distance between each layer is based on stringent airflow tests from our labs.
ACCELERATED AIR PRESSURE TO BEAT THE HEAT
The 2 x MasterFan 120 Air Balance RGB accelerates removal of heat with the 'Push and Pull'. Cold air is drawn into the MA610P heatsink from one side to cool to cool off the heat generated from the CPU. Hot air is then quickly pulled out from the other side to ensure the CPU operates at maximum effiency.
45% MORE CONTACT WITH CDC 2.0
The Continuous Direct Contact 2.0 Technology increases the surface area of the copper base by 45% to maximize the contact and removal heat from the CPU. The total of 6 heatpipes, the MA610P is able to maximize TDP capacities.
EASY INSTALLATION
The easy install mounting kit ensures hassle-free installation. Universal retention brackets are compatible with latest Intel and AMD socket CPU.